/English
SP-X Middle Layer BGA Motherboard Special Solder Paste Mainboard Repair Stannum Planting Plant Tin Pulp for Iphone X
SKUA03249
0 Reviews
USD
12.00
Wholesale Prices :
| Qty: | 4-7 | >=8 |
| Price: | $8.82 | $8.33 |
Qty:
In stock
30-day Return Policy,
Learn More
Description
- weight: 485 g
High density, high impedance
Pure alloy compositin
Fine and sticky
Stannum planting, not bubbing
Silver containing highlight
Model: SP-X
Weight: 50g
Size: 38 x 31 x 35mm
Melting Point: 158℃
Package Included:
1 x SP-X Middle Layer of BGA Motherboard Special Solder Paste
Detail Pictures:
More Details
customers reviews ( 0 )
0
/ 5.0
5 stars
0%
4 stars
0%
3 stars
0%
2 stars
0%
1 stars
0%
