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S500 3D BGA Reballing Stencil CPU Module BGA Reballing Repair Tool for Phone 5 5S 6 6S 7G 7Plus 8 8P
SKUB62259
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Description
- weight: 485 g
Features:
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented phone X Middle Layer Motherboard for Phone X Middle layer motherboard.
Assisting professionals to do Phone X BGA reballing in the most convenient and safest way.
Specification:
Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
Type: A7 CPU / A8 CPU / A9 CPU / A10 CPU / A11 CPU
Package included:
1 x BGA Reballing Tool
1 x BGA Reballing Tool
Details pictures:
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