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MECHANIC Unleaded Solder Paste Fast Welding Cellphone Repairs BGA Main Board NAND CHIP Tin Plant Tin
SKUA03280
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Description
- weight: 485 g
A
Lead-free low temperature.
Melting point: 138℃
B
Medium temperature
Melting point: 183℃
C
Unleaded high temperature
Melting point: 210-227℃
Package Included:1 x MECHANIC Unleaded Solder Paste
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